NETZSCH - Leading Thermal Analysis.
 

Accurate thermal conductivity testing of insulation materials

HFM 436 Lambda - Heat flow meter

 

 

Accuracy: Nanoporous Insulation
How does a measurement in a heat flow meter compare to measurements with other standardized techniques such as guarded hot plate (GHP). As part of a Round Robin Test, a nanoporous insulation board was measured with different NETZSCH heat flow meters as well as with a guarded hot plate system (absolute measurement technique). The results obtained by the different instruments are in agreement within 2.5% in the overlapping temperature range. This clearly demonstrates the outstanding performance of the HFM 436 Series instruments.

Accuracy: Ethylene Propylene Rubber Foam
Presented here are the measurement results on an ethylene propylene rubber foam, measured with an HFM 436/3/1 E. Additionally shown are literature values for this material supplied by the customer. It can clearly be seen that the measurement results are in agreement with the corresponding literature data within 2.5%. Furthermore, it can be seen that the HFM 436/3, connected to an external chiller, can perform measurements even at temperatures of -20°C.

Expanded Polystyrene:
One of the most popular materials for the thermal insulation of buildings is expanded polystyrene. The example shows a quality control run on a commercially available expanded polystyrene material (EPS 040). Ten samples of the same batch were tested at 24°C and, according to DIN EN 13163, at 10°C. It can clearly be seen that the deviation between the different samples is less than 1%. The determined thermal conductivity λ 90/90 value according to DIN 13163 was 0.03808 W/(m*K).


NETZSCH offers instruments for thermal analysis, thermal properties measurement, thermal hazard screening, and contract testing services. Our portfolio is the world's broadest, including a full range of dilatometers to measure high accuracy thermal expansion, classical DSC & TGA, high temperature DSC to 1650°C for specific heat, very high temperature STA (TGA-DSC/DTA) from sub-ambient to 2400°, thermal / evolved gas analysis with fully-integrated FTIR & MS, high resolution TMA and DMA, plus DEA - dielectric analysis for thermoset cure monitoring. We also feature leading-edge technology for thermal conductivity by guarded hot plate and heat flow meters, laser flash thermal diffusivity measurement, thermal hazard screening via adiabatic reaction calorimetry, as well as refractories testing including HMOR, CIC, and RUL. Finally, we offer advanced software packages including thermokinetics for process modeling and development.

Information Request Form
Home
  Methods  Products  Service 

NETZSCH Group


Last update: 04/22/2009 , Copyright © 2000-2006 NETZSCH-Geraetebau GmbH