Laser Flash technique over the broadest temperature range

Bio-Alumina
This figure shows the LFA-measuring results of thermal diffusivity measurements at a sample body from Bio-Alumina with graphite coating on both sides. The measurement results from two different laboratories (KfK x Research Center Karlsruhe, IMF1 and LFA 427 + NETZSCH Applications laboratory) do agree very well.

Pure Copper
The thermal diffusivity of pure copper was measured for both the heating and cooling cycles. The large change in the thermal diffusivity at approximately 1080°C is due primarily to the change in the electronic component of the thermal conductivity upon melting or solidification. The fact that there is almost no difference in the thermal diffusivity values between the heating and cooling cycles indicates that no significant micorstructural changes occured. The measured values of the thermal diffusivity for both the solid and liquid regions deviated from those found in the literature by less than 2.5%. Note that the change in thermal diffusivity provides a good temperature calibration point for the LFA (melting point of pure copper = 1083°C)