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STA 429 CD - Simultaneous TG-DTA up to 2400°C

Unrivaled high-temperature TG and DTA performance up to 2400°C with tungsten furnace

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The robust STA 429 CD can be equipped with side-mounted motorized hoists for the maximum-temperature 2400°C tungsten furnace or for the Skimmer mass spectrometer coupling. In addition, top-mounted single and double hoisting devices for the different types of exchangeable furnaces provide for an extremely broad temperature range of -160°C to 1700°C.

As with all NETZSCH simultaneous systems, the TG and STA sample carriers are equipped with a thermocouple for direct temperature measurement at the sample/reference crucible. Depending on the temperature range and application, a selection of different thermocouple types is available.

The sample carriers can be exchanged within a matter of seconds so that it is possible to switch between TG and TG-DTA or TG-DSC measurements at any time.

The maximum-temperature TG and TG-DTA sample carriers are made of tungsten in the hot zone and have exchangeable tungsten-rhenium thermocouples. Because measurements are only carried out in pure gas atmospheres or under high vacuum, these proven sample carrier systems have a long service life in spite of the high temperature load.

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NETZSCH offers instruments for thermal analysis, thermal properties measurement, thermal hazard screening, and contract testing services. Our portfolio is the world's broadest, including a full range of dilatometers to measure high accuracy thermal expansion, classical DSC & TGA, high temperature DSC to 1650°C for specific heat, very high temperature STA (TGA-DSC/DTA) from sub-ambient to 2400°, thermal / evolved gas analysis with fully-integrated FTIR & MS, high resolution TMA and DMA, plus DEA - dielectric analysis for thermoset cure monitoring. We also feature leading-edge technology for thermal conductivity by guarded hot plate and heat flow meters, laser flash thermal diffusivity measurement, thermal hazard screening via adiabatic reaction calorimetry, as well as refractories testing including HMOR, CIC, and RUL. Finally, we offer advanced software packages including thermokinetics for process modeling and development.

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